The "PACK EXPO" was held from September 11 to 13, 2023, at the Las Vegas Convention Center in the United States, debuting with an unprecedented grand scale. The expo was organized by Packaging Machinery Manufacturers Institute (PMMI). Since its inception in 1995, the expo has grown into the largest packaging exhibition in North America and is one of the most influential professional events in the global packaging industry.
As one of the largest and most influential packaging exhibitions in North America, this year's PACK EXPO was the largest and most comprehensively prepared edition since the event's inception. According to the show's producer, PMMI, The Association for Packaging and Processing Technologies, Pack Expo 2023 was the highest attendance in Las Vegas ever for this show. Over 32,000 attendees interacted with more than 2,300 exhibitors across 1 million net square feet of exhibit space at the Las Vegas Convention Center. PMMI is calling this the most important Pack Expo Las Vegas in its history
PACK EXPO Las Vegas brings together packaging and processing solutions suppliers and end users from 40+ vertical industries. Exhibitors launch products, showcase their latest innovations and problem-solve with customers. Attendees explore thousands of packaging and processing technologies on display and discover game-changing solutions to their packaging and processing challenges.
As a global benchmark for the packaging industry's development and a key platform for technological innovation, PACK EXPO Las Vegas brought together leading companies from the global packaging sector. The event featured thousands of top-tier packaging brands and gathered elite industry professionals, including participants such as Mars Inc., Bayer, AstraZeneca, PepsiCo, Nestlé, and Joywin Intelligent. The expo was bustling with activity, not only driving the vigorous growth of the packaging industry but also opening a new chapter for win-win collaboration across the global supply chain.
During the exhibition, the organizers collaborated with various institutions to host a series of high-level forums. During the event, dozens of forums were held, providing a platform for communication and collaboration across the upstream and downstream sectors of the packaging industry. Experts, industry leaders and representatives from leading enterprises shared policy analyses and forecasts of industry trends, while showcasing their latest packaging and processing solutions. Over 30,000 professionals from more than 40 vertical industries exchanged ideas and shared knowledge through over 100 educational sessions. Together, they discussed innovation, integration, and high-quality development in the packaging industry, ushering in a new era of progress and revitalization for the sector.
At the exhibition, Shanghai Joywin Intelligent Technology Co., Ltd., a leading developer of food packaging technology, made a grand appearance with multiple innovative packaging technologies and solutions. Shanghai Joywin Intelligent Technology Co., Ltd. is a leading intelligent technology company in the domestic industry. The company holds multiple software copyrights and patents in the field of intelligent technology, enhancing the accuracy of intelligent sensing technology. This has addressed issues such as high labor costs and low detection accuracy in the traditional packaging industry. It has established long-term stable partnerships with several multinational companies, leading a new wave of innovative development in the packaging industry. The company has been recognized as a "Specialized, Refined, Differential, and Innovative" enterprise and a High-tech Enterprise, demonstrating strong technological innovation capabilities.
The four-day PACK EXPO has officially concluded. The Pack Expo 2023 Las Vegas marks the beginning of a new journey. Driven by product innovation, packaging industry leading companies will continue to move forward on this new journey. They will consistently pursue technological advancements and product iteration to create greater value for global clients.
Reporter: Zhisen Wang